IT communication cooling solution
3C products, also known as information home appliances, generally refer to computer, communication and consumer electronic products, with a wide variety of market demand, China has become the world's largest 3C product consumer market, with the improvement of national economic level and income level, the quality of electronic products also put forward higher requirements. Businesses have launched higher configuration, higher performance, better designed products to meet consumers.
PCB source temperature ≤100℃ CPU temperature ≤100℃
DCDC export Direction rate: 10W/(m*k) Power: 5W CPU chipsets Direction rate: 10W/(m*k) Power: 10W PCB MST Direction rate: 15W/(m*k) Power: 5W CPU PCB Directive rate: 15W/(m*k) Power: 4W CPU heatsink Size: 125*95*6mm, substrate thickness :2mm, fin quantity: 10pcs
Thickness: 0.6mm; Conductivity: AL-extru. 180W/(m*K). CU piece Size: 41*41*4.7, Conductivity :385 W/(m*k) Thermal paste Thickness: 0.3mm, conductivity :3.5W/(m*K) Welding method Solder 4258, conductivity :48W/(m*k) 0.2mm
Grille front Size :170*27mm, opening rate :0.5 Grille right Size :35*30 mm, opening rate :0.6 Grille back Size :30*30 mm, opening rate :0.7 fan Size :30*30*10 mm
Board top Size :140*170mm, conductivity :10W/(m*k), power :3W Heat source side 0.8W/pcs Heat source body front Left row :0.8W/pcs, right row: 1.2W/pcs,
The row marked "2" :1.5W/pcs. Heatsink Size :140*170*4.5mm, substrate thickness: 2mm, fin height :2.5mm,
Fin quantity :10pcs, fin thickness :0.6mm, conductivity :180W/(m*K). Thermal paste Thickness: 0.3mm, conductivity :3.5W/(m*K).
Board bottom Size :140*170mm, conductivity :10W/(m*k), power :3W. Source of inverse power：1.5W/pcs Heatsink Size :140*170*4.5mm, substrate thickness: 2mm, fin height :2.5mm,
Fin quantity :10pcs, fin thickness :0.6mm, conductivity :180W/(m*K). Thermal paste Thickness: 0.3mm, conductivity :3.5W/(m*K).
Cooling solution Description
(1) Add a 30*10mm axial fan to increase the air flow through the RX module;
(2) Modify the copper fins in front of the fan to increase the air flow of the system.
Copper fin Size :30*12*0.3mm, tilt: 1.0, quantity: 30pcs. Material :C1100, conductivity :385W/(m*K). Heat pipe D6 tube thickness: 3mm, pressure tube process, heat pipe type: powder sintering, conductivity :10000W/(m*k) Add a 30*10mm axial flow fan, and the opening rate of the new fan port area is 0.7. Septum Size :160*33*0.5mm, material: stainless steel
NO. Maximum temperature NO. Maximum temperature NO. Maximum temperature Source 1 59.43 Source 1.7 59.73 Source 3.1 59.59 Source 1.1 59.54 Source 2 60.02 Source 3.2 59.7 Source 1.2 59.66 Source 2.1 60.19 Source 3.3 59.77 Source 1.3 59.73 Source 2.2 60.16 Source 3.4 59.8 Source 1.4 59.76 Source 2.3 59.96 Source 3.5 59.8 Source 1.5 59.77 Source 2.4 59.96 Source 3.6 59.78 Source 1.6 59.76 Source 3 59.48 Source 3.7 59.74
